The technical specifications of Qualcomm’s next high mid-range chipset, the Snapdragon 653 have been leaked on Chinese social network, Weibo. The new processor will have the model number MSM 8976 Pro, signifying that its an upgrade over the Snapdragon 652 which is the MSM 8976.
The Qualcomm Snapdragon 653 is a 28nm high performance mobile (HPM) octa-core chipset, with 4 ARM Cortex A73 cores clocked at 2.0 GHz max, and 4 power efficient A53 cores which can be clocked up to 1.4GHz. The chipset will handle the graphics through an Adreno 515 GPU, supported by two LPDDR4 RAM modules which support upto 1333MHz frequency.
Unfortunately there is no UFS support in the Snapdragon 653, which will instead come with eMMC 5.1 flash storage. The chip will support USB 3.0, while the network options include LTE (Cat 9) with three-band carrier aggregation, a WTR3925 Radio Frequency Transceiver, with integrated Bluetooth 4.1 and WiFi 802.11ac/n.
Photography options with the Snapdragon 653 should prove to be interesting, because it supports 24 megapixel cameras (up from 21 on the SD 652), and Dual ISP (Image Signal Processor).
Qualcomm Snapdragon 653 Technical Specifications:
- Part Number: MSM 8976 Pro
- Process Technology: 28 nm HPM
- Cores: 4 x A73 @ 2.0GHz + 4 x A53 @ 1.4GHz
- GPU: Adreno 515 @ 550MHz
- Memory: 2 x LPDDR4 RAM 1333MHz
- Storage: eMMC 5.1
- Port: USB 3.0 (micro)
- Connectivity: LTE Cat 9 3 x CA (60MHz)/WTR3925
- Wireless: WiFi 802.11ac/n, Bluetooth 4.1
- Camera: Up to 24MP
- Image Signal Processor: Dual ISP
It is unclear when the Snapdragon 653 will be unveiled, but given that the current generation processors in the series the 650 and the 652 were announced well over a year ago (February 2015), the new SoC could be launched soon.