Xiaomi formally launched the Xring O3 at its Xuanjie chip technical briefing on 24 August, and named the first two devices that will carry it: the Xiaomi 18 Fold and the Xiaomi Pad 9 Pro Max, both due in China in September. The O3 arrived alongside two other in-house chips, the Xring O100 AI accelerator and the Xring D100 intelligent-driving processor.
We covered Xiaomi’s announcement of the briefing itself last week. This is what actually came out of it.
What Xiaomi says the Xring O3 does
Every number below comes from Xiaomi’s own briefing slides as reported by IT之家. None of it has been independently tested yet, so treat the percentages as marketing until someone runs a retail phone through a lab.
- CPU: ten cores, all large — six ultra-large cores plus four large cores, peaking at 4.35GHz. Xiaomi claims a 60% performance uplift and says the multi-core score passed 15,000 for the first time.
- GPU: a 16-core G2-Ultra NX with third-generation ray tracing. Claimed 85% more performance at 64% lower power.
- Memory: LPDDR6 support, which Xiaomi says makes the O3 the first mobile processor to carry it, running at 10,667Mbps across a 4×24-bit bus for 113.8GB/s of bandwidth — 48% more than the Xring O1.
- AI: a rebuilt NPU aimed at Xiaomi’s on-device MiMo model, rated at 200 TOPS of tensor and 3.13 TFLOPS of vector compute, with on-device AI performance up 45%.
- Camera: a fifth-generation flagship ISP handling a single 432MP sensor, a 64MP+64MP+50MP triple setup, 24-bit width, and 4K60 AI noise-reduced night video.
- Security: a self-developed RISC-V security core, certified to China’s national cryptography standard and CCRC EAL5+.
Xiaomi also says the chip is built on a 3nm process, took 459 days to develop, and hits 82ns of static latency. The AnTuTu figure Xiaomi is leading with is 5.22 million, which it describes as the first flagship SoC past five million — again, its own run, on its own hardware, under its own conditions.
The LPDDR6 detail worth watching
The most consequential line in the launch may be the memory one. IT之家, citing supply-chain reporting from Chinese financial outlet 财联社, says CXMT is the core LPDDR6 partner for the Xring O3 — which would make this the first time a domestically produced LPDDR6 part has shipped inside a flagship-class processor. With memory prices already pushing up phone and gadget prices worldwide this year, a new domestic LPDDR6 supplier reaching a flagship SoC is a bigger deal for what you eventually pay than any GPU percentage.
Xiaomi 18 Fold and Pad 9 Pro Max in September
Lei Jun posted after the briefing that September will be a 科技大月 — a “big tech month” — for Xiaomi. His plan, as relayed by IT之家: Xiaomi’s new vehicle series goes on sale early in the month with the Xiaomi 18 Fold launching alongside it, and the Xiaomi 18 Pro series follows at the end of September. The 18 Fold is the debut device for the Xring O3, and the Xiaomi Pad 9 Pro Max ships with the same chip. Gizmochina reports that pre-orders for the 18 Fold have already opened in China.
Xiaomi did not discuss markets outside China for either device at the briefing, and its previous in-house SoC stayed largely a China-market part. If the O3 goes the same way, the practical takeaway for buyers elsewhere is narrower than the headline numbers suggest.
The other two chips
The Xring O100 is a 6nm near-memory AI accelerator that stacks compute and memory vertically for up to 1.22TB/s of bandwidth, aimed at on-device AI in phones, cars and robots. The Xring D100 is a 3nm intelligent-driving chip with a 20-core CPU and 16-core NPU, supporting up to 160GB of unified memory and models up to 200 billion parameters run locally; Xiaomi says development is finished and commercial use is planned for 2027. Neither has a price or a shipping product attached today.
Sources: IT之家, Gizmochina
