A leaked Qualcomm project portal screenshot suggests Samsung is already running a Verizon-specific test build of the Galaxy S27, alongside separate builds for Asia-Pacific and Korea. NotebookCheck published the screenshot on September 5 as an exclusive, saying it obtained the image itself. Treat all of it as a leak. Samsung has announced nothing about the Galaxy S27, and Qualcomm has not announced the chip involved either.
What the leaked Galaxy S27 listing shows
The screenshot lists three project entries filed under one Qualcomm chip codename, SM8975. They are labelled for Asia-Pacific, Korea and Verizon. All three carry the same internal software distribution tag, which NotebookCheck describes as Qualcomm’s designation for its upcoming flagship chipsets.
The Verizon entry is the reason this is worth reading. Regional builds are routine. A carrier-specific build is a narrower thing, aimed at one operator’s network requirements rather than at a market in general. NotebookCheck reads the three parallel builds as a sign the hardware has moved past early silicon bring-up and into carrier RF and software testing.
Two caveats worth holding on to. This is one outlet’s reading of one screenshot from a portal nobody outside Qualcomm and its partners can open, so it cannot be independently confirmed. And the absence of other US carriers from the visible entries is not evidence they are being skipped. A screenshot shows what it shows.
The chip’s name is the least settled part of this
NotebookCheck says SM8975 is set to be officially named the Snapdragon 8 Elite Extreme Gen 6, and that Qualcomm will unveil it alongside a standard Snapdragon 8 Elite Gen 6 at Snapdragon Summit, running September 22 to 24 in Hawaii.
The leaks do not agree on that name. SamMobile has been calling the chip in the Galaxy S27 Pro and S27 Ultra the Snapdragon 8 Elite Gen 6 Pro, a name it has used on that site since March. That is a different name for what may or may not be the same silicon. Nobody outside Qualcomm can settle it, and the company’s own announcement this month will. Until then the codename SM8975 is the only part worth treating as stable, because it is what the portal itself uses.
The Galaxy S27 silicon picture, assembled from three separate leaks
No single report describes what is inside the Galaxy S27 line. Three unrelated artefacts over the past week have each added a piece:
- An Exynos part for the cheaper models. A leaked Exynos 2700 die shot, analysed by SemiAnalysis, points to a 10-core CPU on Samsung Foundry’s 2nm SF2P node, expected in the Galaxy S27 and S27+.
- A Qualcomm part somewhere in the range. The portal screenshot covered here, filed under a generic “GS27” label that does not distinguish between the four models.
- Charging, from certification paperwork. China’s 3C database has now taken in all four models, with listings read as 60W wired charging on the S27 Pro and Ultra, and 25W and 45W on the base and Plus.
Taken together, that points at the split Samsung has run before: an Exynos chip lower in the range and a Qualcomm chip higher up, with the exact division still unconfirmed.
What it means if you are waiting on a Galaxy S27
Practically, nothing you can act on yet. There is no price, no date and no confirmed spec here. Qualcomm’s Summit is about two weeks out, and Samsung’s Galaxy S launches have typically landed in the first quarter of the following year, which would put the S27 in early 2027.
The useful part is timing. If US carrier certification work is genuinely underway this early, a Verizon Galaxy S27 looks to be on a normal schedule rather than a late one. Early carrier testing is a reason to expect a normal launch. It is not a promise.
Source: NotebookCheck
