Honor 8X and Honor 8X Max is set to officially launch next month on September 5. A new leak reveals the key specifications of Honor 8X Max. Even though the device is already listed on Chinese certification site TENAA along with all the hardware specification and renders, yet that listing doesn’t reveal the make of the SOC chip that powers the phone.
A new leak on Weibo indicates that Honor 8X Max with model number ARE-AL00 is powered by 2.2 GHz Octa-core Qualcomm Snapdragon 660 processor along with Adreno 502 GPU and 4GB of RAM. It also indicates the phone features a display with Full HD+ resolution (2244 x 1080 pixels) and comes with dual camera module with 16MP primary sensor & 2MP secondary sensor, while there is a 8MP camera at front for selfies & video calls.
These specifications match with the TENAA listing for the same device that we reported sometime back. Other features include 4G VoLTE, Wi-Fi, Bluetooth, GPS, a 3.5mm headphone jack. Sensors onboard the smartphone include accelerometer, ambient light sensor, fingerprint sensor, and proximity sensor. It is backed by a 4,900mAh battery and weighs 210 grams.
At the moment, not much is known about Honor 8X, but we expect it to feature similar hardware with a smaller display, having slightly toned down hardware. We have no clue on the pricing of both the devices and will only know when the official launch happens in China next month. Stay tuned at Androidpure and we will keep you updated.
